Semiconductor - Front End Application CVD CMP Pad Conditioner · Various patterns can be arranged CVD diamond coated tips · Apex of the CVD diamond coated tip is flat face · Allows to engineer the critical pressure applied to each tip for pad conditioning · EHWA has a patents on the tip [...]

Semiconductor - Front End Application New BSL CMP Pad Conditioner · Strong diamond holding force : Chemical reaction + Mechanical contact · Corrosion resistance : Carbide interface between diamond & bond material · Longer lifetime : Utilization of edges by diamond face · Maximized diamond chip pocket by high diamond exposure → [...]

Semiconductor - Front End Application Electroplated CMP Pad Conditioner · Mechanical Bonding (Ni plating) · Excellent disk flatness : Superior wafer uniformity · Clean disk surface : Near zero micro scratches. PDF CATALOGUE

Semiconductor - Front End Application Edge Grinding Wheel · Various groove shapes can be designed. · Grinded with uniform chamfer width (excellent rigidity) · Strong groove shape retention. · Product 1ea enables multi-stage grinding ( rough / fine grinding) PDF CATALOGUE