Project Description


Diamond Wire

· High throughput & Superior cutting quality
– Reduced process lead time and kerf loss
– Enhanced flatness of cut materials and superior warp, TTV and Bow values
· Applicable for thin wafer slicing – Through uniform diamond grit
· Longer wire lifetime – Excellent diamond retention & no wire breakage
· Faster cutting speed – 3~10 times compared with slurry process
· Low cost and eco-friendly – Slurry free process