Electroformed Micro Blade2019-03-16T17:36:23+00:00

Project Description

Micro Blades
Semiconductor – Back End Application

Electroformed Micro Blade

· High accuracy
· Ultra-thin hub-less blade (~50um) vs Metal bond micro blade (>100um)
· Cutting any hard materials (ex Ceramic package, LTCC, HTCC)
· Advantages of cutting PKG with high abrasive content
· High yield long life time
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