New BSL CMP Pad Conditioner2019-01-15T09:50:00+00:00

Project Description

Semiconductor – Front End Application

New BSL CMP Pad Conditioner

· Strong diamond holding force : Chemical reaction + Mechanical contact
· Corrosion resistance : Carbide interface between diamond & bond material
· Longer lifetime : Utilization of edges by diamond face
· Maximized diamond chip pocket by high diamond exposure
→ Excellent conditioning efficiency and pad debris removal rate
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