Back Grinding Wheel -Resin2018-12-14T11:13:18+00:00

Project Description

Semiconductor – Back End Application

Back Grinding Wheel – Resin

1) Rough grinding (Z1)-(#325~600)
① Less edge chipping and grinding damage on thin wafer
② Excellent grinding ability without compromising wheel life time
2) Fine grinding ( Z2 )-( #2000 ~ #4000 )
① Easy grinding with low and consistent grinding current
② Considerably longer life time than competitor’s
③ #3000~#4000 : Superior surface roughness and minimized sawing mark
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