Semiconductor - Back End Application Back Grinding Wheel - Nano Pol(Vitrified) · Wafer surface roughness and die strength can be improved · Grinding stress and wafer edge chipping can be reduced · Diamond at the tip can be distributed consistently · Porosity, pore shape and pore size control can be adjusted · Possible to [...]

Semiconductor - Back End Application Back Grinding Wheel - Resin 1) Rough grinding (Z1)-(#325~600) ① Less edge chipping and grinding damage on thin wafer ② Excellent grinding ability without compromising wheel life time 2) Fine grinding ( Z2 )-( #2000 ~ #4000 ) ① Easy grinding with low and consistent grinding current ② Considerably [...]

Semiconductor - Back End Application Polishing Wheel - DP · Applying dry polishing after processing wafer with back grinding wheel. · Mirror surface processing by using soft wool felt and ZrO2 250mm for improving roughness. PDF CATALOGUE

Semiconductor - Back End Application Polishing Wheel-GDP · Applying dry polishing after processing wafer with back grinding wheel. · Improving roughness and realizing gathering effect by applying spherical silica. PDF CATALOGUE

Semiconductor - Back End Application Micro Blades-Resin · High precision thin with superior cutting efficiency · Maintains free cutting action at high RPM and fast feed rates · Eliminate chipping during the sawing operation PDF CATALOGUE

Semiconductor - Back End Application Micro Blades-Metal · High precision thin with superior cutting efficiency · Maintains free cutting action at high RPM and fast feed rates · Eliminate chipping during the sawing operation PDF CATALOGUE

Semiconductor - Back End Application Electroformed Micro Blade · High accuracy · Ultra-thin hub-less blade (~50um) vs Metal bond micro blade (>100um) · Cutting any hard materials (ex Ceramic package, LTCC, HTCC) · Advantages of cutting PKG with high abrasive content · High yield long life time PDF CATALOGUE [...]

Semiconductor - Back End Application Dicing Blade · High accuracy, super thin blade developed by EHWA · Minimized chipping and superior consistence in quality through stringent particle · Size distribution control · Improve productivity by high feed speed · Providing an optimized solution to the customers PDF CATALOGUE [...]

Semiconductor - Back End Application Notch Wheel (Si) · Various groove shapes can be designed. · Grinded with uniform chamfer width (excellent rigidity) · Strong groove shape retention. · Product 1ea enables multi-stage grinding ( rough / fine grinding) PDF CATALOGUE