Dicing Blade2019-01-15T09:53:54+00:00

Project Description

Micro Blades
Semiconductor – Back End Application

Dicing Blade

· High accuracy, super thin blade developed by EHWA
· Minimized chipping and superior consistence in quality through stringent particle
· Size distribution control
· Improve productivity by high feed speed
· Providing an optimized solution to the customers
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